Manufacturing NFC (Near Field Communication) tags involves several steps, from designing the circuitry to encapsulating the tag. Here's a general overview:

1. Designing the NFC Tag: This involves designing the circuitry of the NFC tag, including the antenna and the integrated circuit (IC) that communicates with NFC-enabled devices.

2. Fabricating the NFC IC: The IC is typically fabricated using semiconductor manufacturing processes. This involves lithography, deposition, etching, and other processes to create the intricate circuitry of the IC.

3. Attaching the Antenna: Once the IC is fabricated, it needs to be attached to an antenna. This is often done using techniques like wire bonding or flip-chip bonding.

4. Encoding Data: NFC tags need to be programmed with the appropriate data that they will transmit when read by an NFC-enabled device. This data can include URLs, text, or other information.

5. Testing: After fabrication and encoding, the NFC tags need to undergo testing to ensure that they function correctly and transmit the intended data.

6. Encapsulation: NFC tags are typically encapsulated in a protective material to shield them from environmental factors like moisture and physical damage. This can involve overmolding or laminating the tag.

7. Packaging: Once encapsulated, the NFC tags are packaged in a form suitable for distribution and use. This might involve placing them on adhesive backings, embedding them in products, or packaging them in rolls or sheets.

8. Quality Control: Throughout the manufacturing process, quality control measures are implemented to ensure that the NFC tags meet the required specifications and standards.

9. Distribution: The manufactured NFC tags are then distributed to customers or integrated into products, ready for use.

It's important to note that manufacturing NFC tags requires specialized equipment and expertise in semiconductor fabrication and RFID technology. Small-scale production may be feasible with the right resources, but large-scale production typically requires significant investment in infrastructure and manufacturing capabilities.